2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific) 2014
DOI: 10.1109/itec-ap.2014.6940980 View full text |Buy / Rent full text
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Abstract: In this paper, we tested the heat dissipating performance of a self-developed 2 in 1 direct cooling IGBT module and contrasted with the traditional indirect cooling module, and a simulation model for the module was verified accurate. The experiment results show that entire thermal resistance of the direct cooling module is reduced up to 33%, meanwhile the temperature field distribution is more uniform. Then we conducted the heat dissipation structure design for a high power density inverter, and got a satisfac… Show more

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