2003
DOI: 10.14356/kona.2003020 View full text |Buy / Rent full text
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Abstract: Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi layer metallization. For an effective polishing, it is necessary to minimize the surface defects while attaining a good planarity with optimal material removal rate. These requirements can be met by controlling the chemical and mechanical interactions during the polishing process, or in other words, by engineering the slurry chemistry, particulate propert… Show more

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